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Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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5N Plus Micro Powders focuses on the production of ultrafine metal powders for the microelectronic market with D50â?Ts ranging from 20 µm down to 2 µm. We offer a wide selection of alloys with melting points starting as low as 61°C and up to 1100°C. Our powders are ideal for use in solder pastes for SMT, S/C packaging and ECA formulations. We have recently developed Type 9 and Type 10 powders for the Mini/MicroLED market using ACP and ACF technologies.
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5N Plus Micro Powders
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