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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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![inspīre solutions LLC Logo]()
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inspīre solutions LLC is a brand-new company with 60 years of SMT experience. The company has developed a disruptive technology for SMT machine fixtures. The completely new technology has been developed to provide superior PCB fixtures for most of the machines in the electronic assembly factory.
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inspīre solutions LLC
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