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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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![inspīre solutions LLC Logo]()
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inspīre solutions LLC is a brand-new company with 60 years of SMT experience. The company has developed a disruptive technology for SMT machine fixtures. The completely new technology has been developed to provide superior PCB fixtures for most of the machines in the electronic assembly factory.
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inspīre solutions LLC
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