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Sponsor
Glenbrook-Technologies

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
Sponsor
BEST-Inc.

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
UPA Technology provides instruments and thickness standards for measuring coating & plating thickness for the PCB & Electronics industries. UPA also provides XRF systems for RoHS and material analysis. Instruments include: X-Ray for plating thickness, RoHs and restricted element analysis.

Handheld Beta Backscatter instruments for measurement of coatings and platings on PC boards, wafers and electronics. CopperDerm systems are also available for measuring surface copper thickness on laminate.

UPA Technology

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8963 Cincinnati-Columbus Road
West Chester, OH 45069 USA
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