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UPA Technology provides instruments and thickness standards for measuring coating & plating thickness for the PCB & Electronics industries. UPA also provides XRF systems for RoHS and material analysis. Instruments include: X-Ray for plating thickness, RoHs and restricted element analysis.
Handheld Beta Backscatter instruments for measurement of coatings and platings on PC boards, wafers and electronics. CopperDerm systems are also available for measuring surface copper thickness on laminate.
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UPA Technology
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