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Sponsor
Circuit-Technology-Center

100+ Expert Repair & Rework Guides - All in One Place
Take the guesswork out of circuit board repair. This guidebook delivers proven methods to help you repair and rework assemblies to IPC standards.
Circuit Technology Center
Sponsor
Master-Bond

Silver Filled Electrically Conductive Epoxy
Master Bond EP3HTSDA-2Med is a silver filled adhesive system with high electrical and thermal conductivity that passes ISO 10993-5 for cytotoxicity.
Master Bond
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computing, automotive, industrial, LED and solar energy.

Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.

Besi North America, Inc.

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Contact Information
33 East Comstock Drive, Suite 7
Chandler, AZ 85225 USA
WEBSITE
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