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Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources
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Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.
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Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computing, automotive, industrial, LED and solar energy.
Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.
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Besi North America, Inc.
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