| Sponsor |
|
AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
|
|
|
Viasystems Group, Inc., headquartered in St. Louis, Missouri, is a leading worldwide provider of complex multi-layer printed circuit boards and electro-mechanical solutions to Original Equipment Manufacturers.
Viasystems offers a cost-competitive, global outsourcing solution for manufacturers of high-quality, high-value products which utilize an advanced electro-mechanical design. Our low cost production facilities can produce complex printed circuit boards, large format backplanes and assemblies, custom sheet metal and enclosures, cabinets, racks and sub racks and electro-mechanical integration/system assemblies.
|
|
Viasystems Group, Inc.
|
Supplier Update Form
|
Use the form below to request updates to this supplier page listing.
|
| Contact Information |
World Headquarters
101 South Hanley Road, Suite 400
St. Louis, Missouri, USA 63105
Phone: 314-727-2087
Fax: 314-746-2233
|
|
WEBSITE
|
|
Return To Listing
|
|
|
|
