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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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Viasystems Group, Inc., headquartered in St. Louis, Missouri, is a leading worldwide provider of complex multi-layer printed circuit boards and electro-mechanical solutions to Original Equipment Manufacturers.
Viasystems offers a cost-competitive, global outsourcing solution for manufacturers of high-quality, high-value products which utilize an advanced electro-mechanical design. Our low cost production facilities can produce complex printed circuit boards, large format backplanes and assemblies, custom sheet metal and enclosures, cabinets, racks and sub racks and electro-mechanical integration/system assemblies.
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Viasystems Group, Inc.
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World Headquarters
101 South Hanley Road, Suite 400
St. Louis, Missouri, USA 63105
Phone: 314-727-2087
Fax: 314-746-2233
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