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Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
R&D Technical Services has been the world's Vapor Phase supplier since 1996. We offer a full line of Vapor Phase Reflow Ovens. From table top batch type units, to production size batch type units, to high volume inline units, to custom designs, R&D does it all.

R&D Technical Services

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