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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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R&D Technical Services has been the world's Vapor Phase supplier since 1996. We offer a full line of Vapor Phase Reflow Ovens. From table top batch type units, to production size batch type units, to high volume inline units, to custom designs, R&D does it all.
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R&D Technical Services
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