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Sponsor
Viscom at SMTA Michigan & Ohio
Join Viscom at SMTA Michigan (8/18/26) and Ohio (8/20/26) to discover the latest advancements in AOI and AXI inspection technology, including our powerful AI solutions. Viscom SE
Sponsor
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling. Advanced Interconnections Corp
The new EVS 1000, 7000 and 9000 Solder Recovery Systems recover on average 50-70% of Solder from your Dross. This equates to a reduction in your solder usage of up to 50% for the same amount of Production. All models have both Lead and Leaf free versions. Rapid Payback is often achieved on purchase price within months.
Self contained process avoids excessive handling of heavy, dirty, contaminated solder dross. Reduces storage and halves de-drossing time. Speeds up wave downtime as EVS Solder Recovery System enables you to dedross faster and more efficiently.
EVS International
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