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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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The new EVS 1000, 7000 and 9000 Solder Recovery Systems recover on average 50-70% of Solder from your Dross. This equates to a reduction in your solder usage of up to 50% for the same amount of Production. All models have both Lead and Leaf free versions. Rapid Payback is often achieved on purchase price within months.
Self contained process avoids excessive handling of heavy, dirty, contaminated solder dross. Reduces storage and halves de-drossing time. Speeds up wave downtime as EVS Solder Recovery System enables you to dedross faster and more efficiently.
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EVS International
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