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Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
It's our job to dig through the hundreds of news stories and articles posted every day around the world covering electronics assembly. We don't waste your time with everyday business news. We select and link to only the biggest of the new ideas and articles.

The result: Circuitnet is designed for business professionals from the world of electronics assembly who have a need to know -- and who bear the responsibility of looking ahead, thinking, imagining the future, and preparing for it. Every business day we package links to these important news stories in a concise, one-page email newsletter.

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22 Parkridge Road
Haverhill, MA 01835 USA
843-682-4755
843-682-4255 (fax)
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