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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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The result: Circuitnet is designed for business professionals from the world of electronics assembly who have a need to know -- and who bear the responsibility of looking ahead, thinking, imagining the future, and preparing for it. Every business day we package links to these important news stories in a concise, one-page email newsletter.
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Circuitnet
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