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Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Process Sciences (PSI) is a process engineering resource center and solutions company. We provide outsourcing options for X-Ray inspection, Failure Analysis, Process Qualifications, Counterfeit Detection and Rework Services that allow our customers to focus on designing and producing circuit board assemblies. We've been serving the circuit assembly and semiconductor industry since 1994.

Process Sciences Inc.

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