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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Process Sciences (PSI) is a process engineering resource center and solutions company. We provide outsourcing options for X-Ray inspection, Failure Analysis, Process Qualifications, Counterfeit Detection and Rework Services that allow our customers to focus on designing and producing circuit board assemblies. We've been serving the circuit assembly and semiconductor industry since 1994.
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Process Sciences Inc.
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