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Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Sponsor
SEIKA-America

SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
At ITM we prepare our electronics assembly clients for tomorrow’s challenges by teaching and applying the principles that underlie the issues of today. We strive to earn trust and respect by providing innovative, effective and successful solutions to both technical and business challenges.

We are committed to providing prompt, responsive and effective advisory services in the most cost-efficient manner possible. Our primary goal is a long lasting collaboration, and a mutually rewarding relationship with every client.

ITM Consulting Inc.

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