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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution.
Indium Corporation
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At ITM we prepare our electronics assembly clients for tomorrow’s challenges by teaching and applying the principles that underlie the issues of today. We strive to earn trust and respect by providing innovative, effective and successful solutions to both technical and business challenges.
We are committed to providing prompt, responsive and effective advisory services in the most cost-efficient manner possible. Our primary goal is a long lasting collaboration, and a mutually rewarding relationship with every client.
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ITM Consulting Inc.
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