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Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
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Since 1982 IIT has been at the forefront of the technologies which have shaped the development of the printed circuit industry. The tradition of innovation and quality forged in those early years continues today.
IIT provides customers not only with the finest quality stencils available but IIT customers also get the benefit of decades of problem solving experience. IIT is not just your stencil vendor, we are your partner in success.
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Integrated Ideas & Technologies, Inc.
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