| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
|
Since 1982 IIT has been at the forefront of the technologies which have shaped the development of the printed circuit industry. The tradition of innovation and quality forged in those early years continues today.
IIT provides customers not only with the finest quality stencils available but IIT customers also get the benefit of decades of problem solving experience. IIT is not just your stencil vendor, we are your partner in success.
|
|
Integrated Ideas & Technologies, Inc.
|
|
