circuit insight
Sponsor
Alltemated

Capital Expenses Significantly Reduced by Eliminating Dispensed Adhesives and Underfills
Learn how you can potentially save $300K-$900K in capital expense with our PLACE-N-BOND Underfilms. Click here.
Alltemated Inc.
Sponsor
ECD

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
Since 1982 IIT has been at the forefront of the technologies which have shaped the development of the printed circuit industry. The tradition of innovation and quality forged in those early years continues today.

IIT provides customers not only with the finest quality stencils available but IIT customers also get the benefit of decades of problem solving experience. IIT is not just your stencil vendor, we are your partner in success.

Integrated Ideas & Technologies, Inc.

Press Releases
Contact Information
6164 West Seltice Way
Post Falls, ID 83854 USAA
WEBSITE
UPDATE THIS LISTING