Sponsor

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies

Sponsor

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

The Integrated Electronics Engineering Center (IEEC), which was established in 1991, pursues research in electronics packaging. This field deals with the process of bringing a semiconductor chip, with its resident circuitry, to a form that can be integrated effectively into a larger microelectronics assembly. Most electronics industry experts believe that advances in electronics performance are limited principally by the current state of the art in packaging technology.

Integrated Electronics Engineering Center (IEEC)

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