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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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The Integrated Electronics Engineering Center (IEEC), which was established in 1991, pursues research in electronics packaging. This field deals with the process of bringing a semiconductor chip, with its resident circuitry, to a form that can be integrated effectively into a larger microelectronics assembly. Most electronics industry experts believe that advances in electronics performance are limited principally by the current state of the art in packaging technology.
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Integrated Electronics Engineering Center (IEEC)
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