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Sponsor
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS
Sponsor
The Industry Standard Solder Paste
Looking to Avoid the Void® and enhance SIR performance? Indium8.9HF is your proven, versatile and stable, no-clean, halogen-free, Pb-free solder paste solution. Indium Corporation
Fein-Line Associates is a consulting group serving the global interconnect industry and those needing contact with, and information regarding the manufacture and assembly of Printed Circuit Boards.
The principal of Fein-Line Associates is Dan (Baer) Feinberg, formally president of Morton Electronic Materials (Dynachem) and a 44 year veteran of the printed circuit and electronic materials industries.
Fein-Line Associates
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