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Best alternative to dispensed adhesives
PLACE-N-BOND underfilm eliminates dispensing and curing in SMT assembly. Use PLACE-N-BOND for solder joint strain relief, shock/drop reliability improvement & encapsulation. Read more.
Alltemated Inc.
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EPA Verified Stencil Cleaning Systems
Low power density ultrasonic cleaners combined with 440-R-SMT detergent provide safe and effective cleaning of stencils, pallets, oven radiators, misprints and SMD adhesives.
Smart Sonic
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Fein-Line Associates is a consulting group serving the global interconnect industry and those needing contact with, and information regarding the manufacture and assembly of Printed Circuit Boards.
The principal of Fein-Line Associates is Dan (Baer) Feinberg, formally president of Morton Electronic Materials (Dynachem) and a 44 year veteran of the printed circuit and electronic materials industries.
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Fein-Line Associates
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