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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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DfR Solutions is the leader in quality, reliability and durability solutions for the electronics industry. We support clients throughout the electronic component and material supply chain, and across a wide range of electronic technology markets including: avionics & aerospace, automotive, consumer, industrial, medical, military, solar and telecommunications.
Our innovative automated design analysis software and industry expertise maximize and accelerate product design for reliability and development, helping clients save time, manage resources and improve customer satisfaction.
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DfR Solutions
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