Research & Technical Papers
Predicting Fatigue of Solder Joints
Chip resistors were subjected to a high number of short ...
Second Generation Pb-Free Alloys
Paper covers shortcomings of current alloys, namely SAC305, and presents ...
Reliability Modeling of Circuit Card Assemblies
Paper illustrates the capabilities and value of a new software ...
Lead-free Reflow and Influence of Moisture
This paper examines concerns relating to lead-free reflow, PCB degradation, ...
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