Diemat, Inc.

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Intraratio

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Diemat developed a low temperature, solder-glass preform for hermetically sealing optical fibers in optoelectronic packages. This technology replaces the more expensive soldering process, which requires fiber metallization. This low temperature glass technology is also utilized in hermetically sealing lenses for the optoelectronic industry, as well as hermetic sealing of package lids.

Diemat, Inc.

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19 Central Street
Byfield, MA 01922

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