| Sponsor |
|
Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
|
|
![Diemat, Inc. Logo]()
|
|
Diemat developed a low temperature, solder-glass preform for hermetically sealing optical fibers in optoelectronic packages. This technology replaces the more expensive soldering process, which requires fiber metallization. This low temperature glass technology is also utilized in hermetically sealing lenses for the optoelectronic industry, as well as hermetic sealing of package lids.
|
|
Diemat, Inc.
|
|
