AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C Ormet® TLPS
Sponsor
SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils. Seika
Techspray formulates, blends, and packages a wide variety of chemicals and assorted support products for the electronics industry - both industrial and consumer.
The emphasis is on quality, customer support, and research and development.
