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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Novastar was established in 1989 with the mission to provide the best value in circuit board soldering machines through cutting-edge technology and superior service at competitive prices. We offer a complete line of Wave Solder Machines as well as Reflow and Curing Ovens.
Novastar pioneered innovations such as baffle-free solder pots, high efficiency preheaters, exchangeable heater technology, efficient low cost forced-air systems and most recently Horizontal Convection reflow oven technology for the precise profiles required by lead free solders.
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Novastar Technologies, Inc.
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