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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
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Novastar was established in 1989 with the mission to provide the best value in circuit board soldering machines through cutting-edge technology and superior service at competitive prices. We offer a complete line of Wave Solder Machines as well as Reflow and Curing Ovens.
Novastar pioneered innovations such as baffle-free solder pots, high efficiency preheaters, exchangeable heater technology, efficient low cost forced-air systems and most recently Horizontal Convection reflow oven technology for the precise profiles required by lead free solders.
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Novastar Technologies, Inc.
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