Sponsor

Future-Ready Bonding Technology
ZTACH® ACE Anisotropic Conductive Epoxy – Cures under reflow or UV and can be a replacement for solder, ACF, ACA, and wire bonding. No underfilling required. Find out more.
Action Integrated Resources

Sponsor

Enhance Your Hands-On Soldering Skills
Learn how IPC certified training workshops for operator and trainer levels can advance skills and knowledge of your personnel for TH and SMT assembly.
BEST Inc.

A.L.M.T. Corp. was established through the merger of Tokyo Tungsten Co., Ltd. and Osaka Diamond Industrial Co., Ltd. in 2000. Since then, we have been growing steadily with i) refinement of high-melting point metals such as tungsten and molybdenum, raw material production and processing technology and ii) manufacturing of precision diamond tools and precision processing technology as our two main operations, playing its part in the industrial raw materials division of the Sumitomo Electric Group.

In order to survive together with our customers in the marketplace that is expected to change drastically in the years to come, we endeavor to create new value based on our core technologies and challenge ourselves to offer better satisfaction to our dear customers.

A.L.M.T. Corp.

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Contact Information

14F, Sumitomofudo-san shiba building, 1-11-11,
Shiba, Minato-ku, Tokyo, Japan 105-0014

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