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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Star Engineering, Inc. believes in offering quality products to its clients at economical rates. Our turnkey services include Circuit Board Assemblies, Cable Assemblies and more. Our experienced team is always ready to offer top class products at competitive prices with supreme flexibility.
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Star Engineering, Inc
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