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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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We're a made-in-USA manufacturer, specializing in equipment used to rework or inspect "Hi-Rel" (high-reliability) microelectronics. Midas-pioneered advanced rework processes are now in common use worldwide, supported by a network of exclusive distributors and sales representatives.
We provide two vital capabilities for Hi-Rel rework: "De-Lid" (removing lids from hermetic packages) and "Hot Gas" removing specific components with precision application of hot gas. Our systems accomplish this without changing package dimensions and without contamination, vibration or thermal damage.
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Midas Technology, Inc.
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