Sponsor

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies

Sponsor

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.

SET is the world's leading supplier of High Accuracy Die to Die & Die to Wafer Bonders. With more than 300 bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the high flexibility of its systems.

SET bonders adapt to all main bonding techniques and guarantee the highest bonding quality (oxide reduction technologies) for the most demanding applications: 3D integration, IR-FPA hybridization, MEMS packaging, advanced photonics packaging.

SET Corporation S.A.

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Contact Information

131, impasse Barteudet
74490 Saint Jeoire - France

WEBSITE

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