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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Over a 20 year period, our solutions to semiconductor lithography processing for wafer level chip scale packaging (WLCSP), FEOL lithography, and 3/5 lithography requirements have evolved to provide more reliability and versatility at a lower cost, than any other process solution provider in the industry. Deployed at fabs worldwide, our semiconductor equipment reliably bakes, coats, and develops millions of wafers every year.
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S-Cubed (Service Support Specialties, Inc.)
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