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Sponsor
Schunk

Depaneling machine for separating circuit boards
SCHUNK offers solutions for the entire spectrum of the depaneling operation — from product selection, workpiece holder solutions and optimization of milling.
SCHUNK
Sponsor
Master-Bond

Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
CEO Jennie S. Hwang has contributed to three arenas-business, technology and academia, encompassing international business, global leadership positions, research management, innovative product development, technology transfer, as well as corporate and university governance...her business engagements span across both Corporate America and entrepreneurial companies.

H-Technologies Group

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