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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond
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Analysis of electronic manufactures of possible generation sources for electrostatic charges - realization of inspections, certification, measurements: electric field strength, charges, resistances; material inspections, qualification of materials at national and international standards. Making of concepts for an optimal ESD control working place, EPAs at national and international standards.
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B.E.STAT group
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