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Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Sponsor
SEIKA-America

SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
Analysis of electronic manufactures of possible generation sources for electrostatic charges - realization of inspections, certification, measurements: electric field strength, charges, resistances; material inspections, qualification of materials at national and international standards. Making of concepts for an optimal ESD control working place, EPAs at national and international standards.

B.E.STAT group

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