Sponsor

Flexibilized LED Curable Adhesive System
Master Bond LED415DC90 is a one part, dual curing adhesive with excellent strength properties that is used to bond both similar and dissimilar substrates.
Master Bond

Sponsor

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.

In the electronics assembly industry where sophistication and complexity reign, NOVATEC strives for simplicity. Our technologies bright by their simplicity, which make them robust, efficient and accessible to everyone. This is why most electronic manufacturers worldwide use our technologies on a daily basis.

All our technologies are developed based on our deep knowledge of the electronic industry and our capability to apprehend the future needs of the electronic manufacturers whatever their specialty. We do not propose incremental improvements, but real breakthroughs, which have a huge potential and various applications.

Novatec SA

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