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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries. The company is owned and operated by engineers who have more than twenty years of experience in dispensing technology.
Corporate headquarters is located in Haverhill, MA. Sales representatives are located worldwide.
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DL Technology
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