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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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In the past 25 years, thousands of robots have been delivered worldwide to the leading manufacturers in automotive electronics, the telecommunications sector, industrial electronics and EMS.
In the future, our intention is to be the market leader in selected standard depaneling, testing, odd-form component placement and laser cutting solutions. To achieve our strict ambitions, we have resellers and sales representatives in all major markets. All the production takes place in Finland.
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Cencorp Corporation
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