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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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At Connor-Winfield we believe that our long-term success can only be achieved by fully satisfying our customers needs, maintaining quality manufacturing processes, and striving to exceed customer expectations.
We are committed to continually improving our products and services, while expanding our capabilities. Connor-Winfield has developed a complete state-of-the-art electronic assembly facility offering a high degree of automation with an emphasis on superior quality.
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The Connor-Winfield Corporation
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