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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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ISI collaborates with our customers to design, manufacture and deliver innovative microelectronic solutions across a variety of industry segments. Utilize ISI’s broad, in-house design and manufacturing capabilities to develop high-reliability products and ramp to production with a quick time to market.
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Interconnect Systems, Inc.
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