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Sponsor
Master-Bond

Flexibilized LED Curable Adhesive System
Master Bond LED415DC90 is a one part, dual curing adhesive with excellent strength properties that is used to bond both similar and dissimilar substrates.
Master Bond
Sponsor
AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Texas Instruments serves the world's most innovative electronics companies, helping them develop new ideas that change the way we live. By providing semiconductor technologies that promote greater power efficiency, enable more features, enhance performance and deliver more value, TI expands the possibilities every day for how we learn, connect, grow and discover.

TI is the leading manufacturer of wireless semiconductors, delivering the foundation of today's wireless technology and solutions and driving innovations to deliver the next generation of mobility.

Texas Instruments Inc.

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