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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Vi TECHNOLOGY is a worldwide global supplier, designing, manufacturing and supporting a wide range of innovative inspection equipment and software solutions; for a wide range of applications for PCB assembly, final test and back-end semiconductor production.
Our goal is to bring true added-value with a high-level of technology differentiation, to increase electronic manufacturing line efficiency and enhance the final product quality. Our mission is to serve our customers worldwide to reach our Total Customer Satisfaction goals.
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Vi Technology
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