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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Formed in 1998 as Speedline Technologies, has built a reputation as an industry innovator dedicated to the development and manufacture of product solutions for the electronics assembly and semiconductor packaging industries.
Speedline is comprised of five best-in-class brands - ACCEL microelectronics cleaning equipment; CAMALOT dispensing systems; ELECTROVERT wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and PROTECT global services, support, and training solutions.
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Speedline Technologies, Inc.
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