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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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We provide turnkey systems for cleaning stencils, pallets and misprints. Our process, which includes our VOC free 440-R detergent and our ultrasonic stencil and pallet cleaners, has been field tested since 1990. Not only has it proven to be successful, but it is also safe and economical.
Our stencil & pallet cleaning system has been verified by the U.S. EPA for specific parameters of environmental safety, user safety and cleaning efficiency! It is guaranteed to clean any type of solder paste from any fine-pitch stencil. Smart Sonic systems utilize Low Power Density for the safe cleaning of misprinted PCBs.
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Smart Sonic
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