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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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For over 25 years, Petroferm has manufactured and supplied high reliability cleaning products for electronic assembly and semiconductor packaging applications. Our cleaners are designed for use in standard inline and batch defluxing systems, stencil and misprint cleaners.
We also have a complete line of manual, non-aqueous products which are ideal replacements for isopropyl alcohol (IPA). Marketed under the AXAREL, BIOACT and HYDREX brands, these products have been specially formulated to meet today's performance, compatibility and environmental requirements.
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Petroferm Inc.
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