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Sponsor
Glenbrook-Technologies

PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
Sponsor
BEST-Inc.

5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
Nihon Handa's R&D efforts in recent years have been focused on the development of lead-free joining materials, which include: Lead Free Solders in various forms, Bar Solder, Solder Paste, Cored Solder and Solder Spheres are available in PF27 (Sn/Ag/Cu) and PF33 (Sn/Ag/Cu/Bi) alloys.

Specially formulated no-clean paste fluxes will endure long, high-temperature preheating environment to achieve good wetting of lead-free solder.

Nihon Handa Company Ltd.

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