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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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High Temp & Chemical Resistant Epoxy
Master Bond EP62-1AO is an electrically insulating adhesive that withstands harsh chemical environments while delivering thermal conductivity. View full specs.
Master Bond
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IGI produces commercial applications with proven success in PCB and semiconductor manufacturing. IGI software solutions can help you succeed. We collaborate with you — customizing and innovating as you require, or offering one of our tried and true CAD/CAM solutions.
IGI is experienced in customizing software for OEMs with RIP, AOI, Ink Jet, Border Tooling Generation for Semiconductor Testing, and automated Solder Paste Stencil Generation solutions.
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Infinite Graphics Inc.
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