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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Henkel Corporation's Adhesive Technologies Industrial Business (AEI) is focused on developing high-performance materials for a variety of applications in the power and industrial automation, telecom/datacom, aerospace, medical, lighting, and home appliance markets, among others.
Under the leading brands of LOCTITE and BERGQUIST, Henkel's AEI team formulates and supplies multiple products including adhesives in various formats, thermal management materials, solders, encapsulants, low pressure molding materials, inks, coatings, underfills, potting materials and EMI shielding solutions.
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Henkel Corporation
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